Tin Plating & Immersion Tin Plating
Tin Plating is an electrolytic process that deposits a metallic coating onto the surface of the material. The tin plating process is used extensively to protect both ferrous and nonferrous surfaces. Tin is a useful metal for the food processing industry since it is non-toxic, ductile, and corrosion resistant. It also provides sacrificial protection for copper, nickel and other non-ferrous metals, but not for steel.
Immersion Tin Plating
Similar to Tin Plating, but is deposited by chemical means. The parts are placed into a process bath that deposits the coating uniformly. Immersion Tin Plating is typically used in the circuit board industry to increase the corrosion resistance and reduce short circuits. Typical thickness is less than 0.000001″.
Chromate Conversion, also known as Chem-Film, is a coating that chemically reacts with the surface of the material to form a soft gelatinous film when first applied. After time the film hardens and becomes hydrophobic. It’s purpose is to provide maximum corrosion protection to aluminum and act as a base for paint primers. Conversion coatings are typically very thin, around 0.00001″.
Copper Plating is an electrolytic process that uses externally applied current to deposit a soft, dull, or bright metallic coating. Copper is commonly used to build up lost tolerances, fill in non-uniform surfaces, and generally help with adhesion. The copper deposit aids in brazing, thermal conductivity, electrical properties, and works as a thermal stop off during heat treatments.
We offer Full Masking Capability as well as a Teflon coating option which improves performance and prevents the surface of your products from sticking.